Efficient spreaders for cooling high-power computer chips

Author:

El-Genk Mohamed S.,Saber Hamed H.,Parker Jack L.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference27 articles.

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1. Thermal performance of a pin-finned vapor chamber heat spreader for CPU cooling applications;Journal of the Brazilian Society of Mechanical Sciences and Engineering;2024-04-02

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3. Sustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules;Sustainability;2021-11-12

4. Investigation to Enhance the Performance of Computer Processor Cooling System;IOP Conference Series: Materials Science and Engineering;2020-10-01

5. Experimental investigation of using thermoelectric cooling for computer chips;Journal of King Saud University - Engineering Sciences;2020-07

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