1. Why is CMOS scaling coming to an END?;Haron,2008
2. Darpa’s intra/interchip enhanced cooling (icecool) program;Bar-Cohen,2013
3. The evolution of dense embedded memory in high performance logic technologies;Iyer,2012
4. Air cooling limits of 3D stacked logic processor and memory dies;Kumari,2014
5. Improving data center energy efficiency with advanced thermal management;Chainer;IEEE Trans. Components, Packag. Manuf. Technol.,2017