Experimental study on the moisture removal of a 450-mm FOUP during the purge or vacuum process

Author:

Hu Shih-Cheng,Huang Zhe-Yu,Fu Ben-Ran

Funder

Southern Taiwan Science Park Bureau

Ministry of Science and Technology of R.O.C.

Gudeng Company, R.O.C.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference28 articles.

1. R. Aggarwal, Front opening unified pod, US Patent No. US6899145B2, 2005.

2. Origin of trace organic contaminants adsorbed on the surface of silicon wafers in a manufacturing line;Park;Anal. Sci.,2002

3. Time-dependent airborne organic contamination on silicon wafer surface stored in a plastic box;Habuka;Jpn. J. Appl. Phys.,2003

4. Short time deposition kinetics of diethyl phthalate and dibutyl phthalate on a silicon wafer surface;Kang;Ind. Eng. Chem. Res.,2006

5. Mathematical modeling of the AMCs cross-contamination removal in the FOUPs: finite element formulation and application in FOUP’s decontamination;Santatriniaina;Int. J. Math. Comput. Sci. Eng.,2014

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