Author:
Yu Jia,Zhu Qingshan,Zhu Hongji,Yu Chengxin
Funder
National Natural Science Foundation of China
Reference28 articles.
1. A critical review of traditional and emerging techniques and fluids for electronics cooling;Sohel Murshed;Renew. Sustain. Energy Rev.,2017
2. D. Sun, L. Shen, B. Niu, C. gao, P. Zhou, J. Tang, B. Ye, L. Yang, Active thermal management of hotspot under thermal shock based on micro-thermoelectric cooer and bi-objective optimization, Energy Convers. Manage. 252 (2022).
3. High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices;Touzelbaev;J. Electron. Packag.,2013
4. Efficient Thermoelectric Cooler for Localized Cooling in Electronic Devices;Kumar;J. Therm. Sci. Eng. Appl.,2023
5. Experimental investigation of using thermoelectric cooling for computer chips, Journal of King Saud University -;Al-Shehri;Eng. Sci.,2020