Three-dimensional fluid-thermal–mechanical coupling numerical modeling of elastocaloric cooler for electronic chip-Reference-Cited by-同舟云学术

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Three-dimensional fluid-thermal–mechanical coupling numerical modeling of elastocaloric cooler for electronic chip

Published:2024-07 Issue: Volume:248 Page:123199
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Dong Xingkun^ORCID,Jiang Xiangjun^ORCID,Li Peng,Mi Yong,Liu Qi

Publisher

Elsevier BV

Reference53 articles.

1. Energy-efficient miniature-scale heat pumping based on shape memory alloys;Ossmer;Smart Mater. Struct.,2016

2. Caloric Micro-Cooling: Numerical modelling and parametric investigation;Kalizan;Energ. Conver. Manage.,2020

3. Cooling, Heating, Generating Power, and Recovering Waste Heat with Thermoelectric Systems;Bell;Science,2008

4. Demonstration of high efficiency elastocaloric cooling with large ΔT using NiTi wires;Cui;Appl. Phys. Lett.,2012

5. An inconvenient truth about thermoelectrics;Vining;Nat. Mater.,2009

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Application of 3D and 4D Printing in Electronics;Journal of Manufacturing and Materials Processing;2024-07-31

2. Numerical Study of an Enhanced Heat Driven Elastocaloric Cooling System;2024

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