Study on the efficient heat transfer mechanism of microchannel pin-fin arrays under low pumping power-Reference-Cited by-同舟云学术

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Study on the efficient heat transfer mechanism of microchannel pin-fin arrays under low pumping power

Published:2024-03 Issue: Volume:241 Page:122386
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Sun Zhikun^ORCID,Wang Tiantian,Qian Bosen,Wang Yu,Wang Junyan,Hong Chen

Publisher

Elsevier BV

Reference50 articles.

1. The IGBT device: physics, design and applications of the insulated gate bipolar transistor;Baliga,2015

2. High power density thermal management of discrete semiconductor packages enabled by additively manufactured hybrid polymer-metal coolers;Lad;Appl. Therm. Eng.,2023

3. Thermal performance of insulated gate bipolar transistor module using microchannel cooling base plate;Shi;Appl. Therm. Eng.,2022

4. Thermal parameter monitoring of IGBT module using case temperature;Zhang;IEEE Trans. Power Electron.,2018

5. Flat plate pulsating heat pipes: A review on the thermohydraulic principles, thermal performances and open issues;Ayel;Appl. Therm. Eng.,2021

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1. Improving heat transfer performance in serpentine microchannel with carbon nanotube-embedded PVDF coating;Case Studies in Thermal Engineering;2024-09

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