Optimization and comparison of double-layer and double-side micro-channel heat sinks with nanofluid for power electronics cooling-Reference-Cited by-同舟云学术

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Optimization and comparison of double-layer and double-side micro-channel heat sinks with nanofluid for power electronics cooling

Published:2014-04 Issue:1-2 Volume:65 Page:124-134
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Sakanova Assel,Yin Shan,Zhao Jiyun,Wu J.M.,Leong K.C.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference56 articles.

1. Thermal performance of a dual 1.2 kV, 400 A silicon-carbide MOSFET power module;Boteler,2010

2. Double-sided IPEM cooling using miniature heat pipes;Martens;IEEE Trans. Compon. Packag. Technol.,2005

3. Compact double-side liquid-impingement-cooled integrated power electronic module;Johnson,2007

4. High performance heat sinking for VLAI;Tuckerman;IEEE Electron. Devices Lett.,1981

5. Micro-channel thermal management of high power devices;Solovitz,2006

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