Forced air cooled heat sink with uniformly distributed temperature of power electronic modules-Reference-Cited by-同舟云学术

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Forced air cooled heat sink with uniformly distributed temperature of power electronic modules

Published:2021-11 Issue: Volume:199 Page:117560
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Bünnagel Christian,Monir Shafiul,Sharp Andrew,Anuchin Alecksey,Durieux Olivier,Uria Ikea,Vagapov Yuriy

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference18 articles.

1. Reliability of power electronic systems: An industry perspective;Falck;IEEE Industrial Electronics Magazine,2018

2. Research on lifetime distribution and reliability of IGBT module based on accelerated life test and K-S test;Wu;Int. Journal of Engineering Systems Modelling and Simulation,2019

3. An industry-based survey of reliability in power electronic converters;Yang;IEEE Trans. on Industry Applications,2011

4. Energy efficient heat sink design: Natural versus forced convection cooling;Christen;IEEE Trans. on Power Electronics,2017

5. A temperature gradient-based potential defects identification method for IGBT module;Gao;IEEE Trans. on Power Electronics,2017

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5. Thermal management and multi-objective optimization of an air-cooled heat sink based on flat miniature-heat-pipe arrays;Journal of Thermal Analysis and Calorimetry;2023-12-18

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