Ultrahigh-density trench capacitors in silicon and their application to integrated DC-DC conversion

Author:

Roozeboom F.,Bergveld H.J.,Nowak K.,Le Cornec F.,Guiraud L.,Bunel C.,Iochem S.,Ferreira J.,Ledain S.,Pieraerts E.,Pommier M.

Publisher

Elsevier BV

Subject

General Medicine

Reference8 articles.

1. Handbook of 3-D Integration: Technology and Applications of 3D Integrated Circuits,2008

2. Passive and heterogeneous integration towards a silicon-based System-in-Package concept;Roozeboom;Thin Solid Films,2006

3. More than Moore: towards passive and Si-based System-in-Package Integration;Roozeboom;Electrochem. Soc. Symp. Proc.,2005

4. ALD options for Si-integrated ultrahighdensity decoupling capacitors in pore and trench designs;Roozeboom;Electrochem. Soc. Trans.,2007

5. An Inductive Down Converter System-in-Package for Integrated Power Management in Battery-Powered Applications;Bergveld;Proc. IEEE Power Electronics Specialists Conf., PESC'08, Rhodes, Greece,2008

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3. PSi-Based Supercapacitors;Porous Silicon: From Formation to Applications: Optoelectronics, Microelectronics, and Energy Technology Applications, Volume Three;2016-01-07

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