1. Handbook of 3-D Integration: Technology and Applications of 3D Integrated Circuits,2008
2. Passive and heterogeneous integration towards a silicon-based System-in-Package concept;Roozeboom;Thin Solid Films,2006
3. More than Moore: towards passive and Si-based System-in-Package Integration;Roozeboom;Electrochem. Soc. Symp. Proc.,2005
4. ALD options for Si-integrated ultrahighdensity decoupling capacitors in pore and trench designs;Roozeboom;Electrochem. Soc. Trans.,2007
5. An Inductive Down Converter System-in-Package for Integrated Power Management in Battery-Powered Applications;Bergveld;Proc. IEEE Power Electronics Specialists Conf., PESC'08, Rhodes, Greece,2008