One-Side Cutting Strategy for Ultraprecise Single Point Cutting of V-grooves Case 1: Constant Chip Thickness

Author:

Joao Delfim,Milliken Nicolas,Tutunea-Fatan O. Remus,Bordatchev Evgueni V.

Publisher

Elsevier BV

Subject

Control and Systems Engineering

Reference8 articles.

1. Performance of single crystal diamond tools with different rake angles during micro-grooving on electroless nickel plated die materials;BIDDUT;International Journal of Advanced Manufacturing Technology,2007

2. BORDATCHEV, E.V., TAUHIDUZZAMAN, M., & Dey, R. 2014. Enhancement of photovoltaic cell performance using periodic triangular gratings. J. of Photonics for Energy, 4, paper 044599, 18 p.

3. FLUCKE, C., GLÄBE, R. & BRINKSMEIER, E. 2007. Diamond micro chiselling: cutting of prismatic micro optic arrays. Proc. 7th Int. Conf. European Society for Precision Engineering and Nanotechnology (EUSPEN), Bremen, Germany, 20-24 May 2007, 4 p..

4. GUOA, J., ZHANG, J., WANG, H., LIU, K. & KUMAR, A. S. 2018. Surface quality characterisation of diamond cut V-groove structures made of rapidly solidified aluminium RSA-905. Precision Engineering, 53, 120-133

5. JOAO, D., MILLIKEN, N., BORDATCHEV, E.V., & TUTUNEA-FATAN, O.R. 2019. Axial strategy for ultraprecise single point cutting of V-grooves. Case 1: Constant chip thickness. Procedia Manufacturing, in press

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