Author:
Kuo Dong-Hau,Liao Wen-Chieh
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference27 articles.
1. H.O. Pierson, Handbook of Chemical Vapor Deposition: Principles, Technology, and Applications, Noyes Publications, Westwood, New Jersey, USA, 1992, pp. 222–226.
2. D.G. Bhat, in: K. Spear, G. Cullen (Eds.), Proceedings of the 11th International Conference on CVD, Electrochemical Society, Pennington, NJ, 1990, p. 648.
3. Growth and Properties of LPCVD Titanium Nitride as a Diffusion Barrier for Silicon Device Technology
4. Relationship Between the Process Parameters and Film Properties of “Low Temperature” Low Pressure Chemical Vapor Deposition Titanium Nitride Films
5. Thermodynamics of the Formation of TiN from TiCl4 ‐ NH 3 ‐ H 2 on a Patterned Oxidized Silicon Substrate
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献