Author:
Bchir Omar J,Johnston Steven W,Cuadra Amalia C,Anderson Timothy J,Ortiz Carlos G,Brooks Benjamin C,Powell David H,McElwee-White Lisa
Subject
Materials Chemistry,Inorganic Chemistry,Condensed Matter Physics
Reference49 articles.
1. Amorphous Ta-Si-N diffusion barriers in Si/Al and Si/Cu metallizations
2. Back to the Future: Copper Comes of Age, IBM Research 35(4) (1997), http://www.research.ibm.com/resources/magazine/1997/issue_4/copper497.html.
3. Investigation of copper metallization induced failure of diode structures with and without a barrier layer
4. TiN and TaN as diffusion barriers in metallizations to silicon semiconductor devices
5. B.L. Sharma, in: CRC Handbook of Chemistry and Physics 1999–2000, 80th Ed., D.R.Lide (Ed.), CRC Press, Cleveland, OH, 1999, p. 12–108.
Cited by
58 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献