1. Research Needs in Electronic Cooling;Hannemann,1986
2. An old idea may solve VHSIC cooling problem;Waller;Electronics,1985
3. Evaluation of heat pipes for conduction-cooled level II avionic packages;Scott;Heat Transfer Engng,1988
4. Thermal management of high power PWBs through the use of heat pipe substrates;Basiulis,1986
5. An approach to solving the hot spot cooling problem in electronic packaging;Ciekurs;ASME Paper No. 86-WA/EEP-l,1986