Synthesis and characterization of low-temperature polyamide 6 (PA6) copolyamides used as hot melt adhesives and derived from the comonomer of novel aliphatic diamine bis(2-aminoethyl) adipamide and adipic acid

Author:

Chen Yu-Hao,Chen Chin-Wen,Way Tun-Fun,Rwei Syang-Peng

Funder

the Ministry of Science and Technology of Taiwan

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference38 articles.

1. Handbook of adhesives,2011

2. Polyamides derived from piperazine and used for hot-melt adhesives: synthesis and properties;Chen;Int J Adhesion Adhes,2002

3. Low-melting copolyamide and their use as hot-melt adhesives;Gerhard,2003

4. Nylon 6/66/11 copolymer used for hot-melt adhesives: synthesis and properties;Jin;J Adhes Sci Technol,2009

5. Long carbon chain nylon hot melt glue and its synthesis method;Zhang,2005

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