Effects of wheat flour levels on the thermal curing behavior of Urea–Formaldehyde and Phenol–Formaldehyde resins
Author:
Funder
Korea Forestry Promotion Institute
University of Florida
Publisher
Elsevier BV
Reference55 articles.
1. Recent progress in ultra-low formaldehyde emitting adhesive systems and formaldehyde scavengers in wood-based panels: a review;Kristak;Wood Mater Sci Eng,2022
2. Recent advances in urea–formaldehyde resins: converting crystalline thermosetting polymers back to amorphous ones;Wibowo;Polym Rev,2022
3. Formaldehyde-Free resins for the wood-based panel industry: alternatives to formaldehyde and novel hardeners;Chrobak;Molecules,2022
4. A dynamic mechanical analysis method for predicting the curing behavior of phenol-formaldehyde resin adhesive;Lei;J Adhes Sci Technol,2015
5. Theory and practice of the preparation of low formaldehyde emission uf adhesives;Pizzi;Holzforschung,1994
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