Investigation and neural network prediction of wood bonding quality based on pressing conditions
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference40 articles.
1. The effect on shear strength of different surfacing techniques in Oriental beech (Fagus orientalis Lipsky) and Scotch pine (Pinus sylvestris L.) bonded joints;Burdurlu;J Adhes Sci Technol,2007
2. Adhesive bonding, science, technology and applications;Adams,2005
3. Techniques to reduce the peel stresses in adhesive joints with composites;da Silva;Int J Adhes Adhes,2007
4. Improving performance of polyvinylacetate (PVA) as a binder for wood by combination with melamine based adhesives;Kaboorani;Int J Adhes Adhes,2011
5. Adhesion properties between polyvinyl acetate dispersion and ammonia modified Oak wood;Minelga;Mater Sci (Medžıagotyra),2013
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