Interfacial fracture toughness measurement for thin film interfaces
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference12 articles.
1. A new procedure for measuring the decohesion energy for thin ductile films on substrates;Bagchi;J. Mater. Res.,1994
2. Interface crack between two elastic layers;Suo;Int. J. Fract.,1990
3. Modi M, Sitaraman SK. Effect of adhesive layer properties on fracture in thin film high density interconnects. In: Proceedings of 52nd ECTC, San Diego, 2002
4. A method for calculating stress intensities in bimaterial fracture;Matos;Int. J. Fract.,1989
5. Warpage and interfacial stress distribution in a single-level integrated module (SLIM);Dunne;J. Electron. Packaging,1997
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