Author:
Hoffman V.,Griswold J.,Mintz D.,Harra D.
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Cited by
17 articles.
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1. Chip Integration;Handbook of Semiconductor Interconnection Technology, Second Edition;2006-02-22
2. Contact Hole Filling by Cu Reflow Self-Sputtering;Electrochemistry;1999-11-05
3. Reflow of copper in an oxygen ambient;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;1998-09
4. Metal-organic chemical vapor deposition of aluminum from dimethylethylamine alane;Thin Solid Films;1998-01
5. Surface diffusion of Ge on Si(111): Experiment and simulation;Physical Review B;1997-05-15