Integration of copper multilevel interconnects with oxide and polymer interlevel dielectrics

Author:

Gutmann Ronald J.,Chow T.Paul,Lakshminarayanan S.,Price David T.,Steigerwald Joseph M.,You Lu,Murarka Shyam P.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference20 articles.

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4. Proc. 1993 IEDM;Cho,1993

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