Author:
Dietrich S.,Schneegans M.,Moske M.,Samwer K.
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. Reduction of Electromigration in Aluminum Films by Copper Doping
2. Proc. 8th Conf. un Adv. Metallization for ULSI Applications;Ho,1993
3. Stress-Induced Phenomena in Metallization;Schneegans,1994
4. Texture in multilayer metallization structures
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