Ply thickness dependence of the intralaminar fracture in thin-ply carbon-epoxy laminates
Author:
Publisher
Elsevier BV
Subject
Mechanics of Materials,Ceramics and Composites
Reference16 articles.
1. North Thin Ply Technology (NTPTTM). [16th December 2016].
2. Thin ply composites: experimental characterization and modeling of size-effects;Amacher;Compos Sci Technol,2014
3. Experimental studies of thin-ply laminated composites;Sihn;Compos Sci Technol,2007
4. Frossard G, Cugnoni J, Gmür T, Botsis J. Mode I interlaminar fracture of carbon epoxy laminates: effects of ply thickness. Compos Part A 2016; 91: 1–8.
5. Thickness-dependence of the translaminar fracture toughness: experimental study using thin-ply composites;Teixeira;Compos Part A,2016
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