A metal-based microencapsulated phase change material (MEPCM) with high thermal conductivity, electrical insulation and flame retardancy and its application in epoxy resin-Reference-Cited by-同舟云学术

A metal-based microencapsulated phase change material (MEPCM) with high thermal conductivity, electrical insulation and flame retardancy and its application in epoxy resin

Published:2024-05 Issue: Volume:180 Page:108081
ISSN:1359-835X
Container-title:Composites Part A: Applied Science and Manufacturing
language:en
Short-container-title:Composites Part A: Applied Science and Manufacturing

Author:

Chen Yuanyuan,Shi Chenwu,Guo Xiaojie,Qing Chunyao,Zou Deqiu^ORCID

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference79 articles.

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