An inter-ply friction model for thermoset based fibre metal laminate in a hot-pressing process
Author:
Funder
China Scholarship Council
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites
Reference44 articles.
1. Fiber metal laminates: an advanced material for future aircraft;Asundi;J Mater Process Technol,1997
2. A review: fibre metal laminates, background, bonding types and applied test methods;Sinmazçelik;Mater Des,2011
3. Matrix materials;Wang;Polym Matrix Compos Technol,2011
4. Processing of thermoset prepregs for high-volume applications and their numerical analysis using superimposed finite elements;Khan;Compos Struct,2015
5. Characterisation of the thermosetprepreg compression moulding process;Pasco;ACCE SPE Conf,2016
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