Evaluation of the thermal, mechanical and dynamic mechanical characteristics of modified graphite nanoplatelets and graphene oxide high-density polyethylene composites
Author:
Funder
Mitacs and Carbon Upcycling Technologies
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites
Reference48 articles.
1. The rise of graphene;Novoselov;Nat Mater,2007
2. Trends and frontiers in graphene-based polymer nanocomposites;Mukhopadhyay;Plast Eng,2011
3. Extremely high thermal conductivity of graphene: prospects for thermal management applications in nanoelectronic circuits;Ghosh;Appl Phys Lett,2008
4. Superior thermal conductivity of single-layer graphene;Balandin;Nano Lett,2008
5. Ultrahigh electron mobility in suspended graphene;Bolotin;Solid State Commun,2008
Cited by 57 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Combined effect of montmorillonite Cloisite 30B and graphene nanoplatelets on high‐density polyethylene matrix under high strain rate dynamic compression;Journal of Applied Polymer Science;2024-06-11
2. Fused Filament Fabrication of Polyethylene/Graphene Composites for In-Space Manufacturing;Materials;2024-04-19
3. Mechanical, thermal, and dynamic compression of high-density polyethylene nanocomposites with graphene, montmorillonite, and calcium carbonate;Polymer Bulletin;2024-02-24
4. Investigating Mechanical, Viscoelastic, and Tribological Properties of PA6/HDPE + GO Polymer Blend Nanocomposites;Journal of Materials Engineering and Performance;2024-02-21
5. Mechanical reinforcement from two-dimensional nanofillers: model, bulk and hybrid polymer nanocomposites;Nanoscale;2024
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3