Thermodynamic assessment of Sn–Cu–Ce system-Reference-Cited by-同舟云学术

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Thermodynamic assessment of Sn–Cu–Ce system

Published:2013-12 Issue: Volume:43 Page:124-132
ISSN:0364-5916
Container-title:Calphad
language:en
Short-container-title:Calphad

Author:

Li Juan,Tao Xiaoma,Dong Sisi,Yang Feng,Liu Huashan,Jin Zhanpeng,Zheng Feng

Funder

National Natural Science Fund of China

Publisher

Elsevier BV

Subject

Computer Science Applications,General Chemical Engineering,General Chemistry

Reference30 articles.

1. Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys

2. Comparative study of microstructures and properties of three valuable SnAgCuRE lead-free solder alloys

3. Thermodynamic assessment of Al–Ce–Cu system

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1. Thermal and compositional fields to maneuver Cu6Sn5 intermetallic growth on (111) nanotwinned copper substrate;Journal of Alloys and Compounds;2024-09

2. Design of the rare-earth-containing materials based on the micro-alloying phase equilibria, phase diagrams and phase transformations;Journal of Materials Science & Technology;2023-07

3. Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn–30Sn–2Cu high temperature lead-free solder alloy;Journal of Materials Science: Materials in Electronics;2020-08-12

4. Microstructure and performance of brazed diamond segments with NiCr–x(CuCe) composite alloys;Ceramics International;2020-06

5. Experimental Study on the Thermodynamics of the CaO-SiO2-Ce2O3 System at 1873 K;Metallurgical and Materials Transactions B;2018-12-07

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