Author:
Liu Shiqian,Tan Xin Fu,McDonald Stuart D.,Gu Qinfen,Matsumura Syo,Nogita Kazuhiro
Funder
China Scholarship Council
Kyushu University
Australian Research Council
ANSTO
Nihon Superior Co Ltd
Government of Japan Ministry of Education Culture Sports Science and Technology
The University of Queensland
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Reference28 articles.
1. Low temperature bonding technology for 3D integration;Ko;Microelectron. Reliab.,2012
2. Thermal degradation of DRAM retention time: characterization and improving techniques;Kim;IEEE Int. Reliab. Phys. Symp. Proc.,2004
3. Materials, processing and reliability of low temperature bonding in 3D chip stacking;Zhang;J. Alloys Compd.,2018
4. A review: on the development of low melting temperature Pb-free solders;Kotadia;Microelectron. Reliab.,2014
5. Stretchable and soft electronics using liquid metals;Dickey;Adv. Mater.,2017
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献