The 260°C phase equilibria of the Sn–Sb–Cu ternary system and interfacial reactions at the Sn–Sb/Cu joints
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Reference24 articles.
1. Investigation of multi-component lead-free solders
2. Microelectronics packaging handbook;Koopman,1989
3. Finite element analysis for Solder Ball Connect (SBC) structural design optimization
4. Konecke S. Private communication, Loral Co., Manassas, MD.
5. Attachment of Solder Ball Connect (SBC) packages to circuit cards
Cited by 39 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Rapidly Synthesizing Cu2Sb Phase of Tetragonal Structure by Electrothermal Explosion;International Journal of Self-Propagating High-Temperature Synthesis;2024-03
2. Synergistic effect of MWCNT addition on the thermal and elastic properties of Sn–5Sb–0.3Cu alloy;Journal of Materials Science: Materials in Electronics;2023-12
3. Combination of enhanced strength-ductility trade-off and stress relaxation resistance of MWCNTs reinforced Sn–5Sb-0.3Cu matrix composite;Materials Chemistry and Physics;2023-02
4. Structural and Magnetic Properties of MgCu2 Laves Phase Alloys Synthesized by Electrothermal Explosion;International Journal of Self-Propagating High-Temperature Synthesis;2022-06
5. Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints;Microelectronics Reliability;2021-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3