Recrystallization of gold alloys for producing fine bonding wires

Author:

Qi Guojun,Zhang Sam

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites

Reference8 articles.

1. Metallurgical Fundamentals of Gold Bonding Wire;Douglas,1980

2. Gold bonding wire for semiconductor applications;Tomiyama;Gold Bull.,1982

3. Gold wire for automated bonding;Gehman;Solid State Technol.,1980

4. Annealing and recrystallization kinetics of ultrathin gold wires: Modulus and resistivity measurements;Busch;Scripta Metall.,1988

5. Metallurgical behavior of gold wire in thermal compression bonding;Ramsey;Solid State Technol.,1973

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