Deformation and material removal rate in polishing silicon wafers
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites
Reference18 articles.
1. An understanding of the chemical effect on the nano-wear deformation in mono-crystalline silicon components
2. Effect of ultraprecision grinding on the microstructural change in silicon monocrystals
3. Subsurface damage in single-crystal silicon due to grinding and polishing
4. Material removal in the optical polishing of hydrophilic polymer materials
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