Joining of AlN ceramic to metals using sputtered Al or Ti film-Reference-Cited by-同舟云学术

Joining of AlN ceramic to metals using sputtered Al or Ti film

Published:2001-02 Issue:3 Volume:109 Page:277-282
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Zhu Sheng,Włosiński Władysław

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites

Reference9 articles.

1. High-Thermal-Conductivity Aluminum Nitride Ceramics: The Effect of Thermodynamic, Kinetic, and Microstructural Factors

2. Some observations on the wetting and bonding of nitride ceramics

3. Y.V. Naidich, N.Y. Taranets, in: Proceedings of the International Conference on High Temperature Capillary, Bratislava, Slovakia, 1995, pp. 138–142.

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