Characterization of ternary Ni2SnP layer in Sn–3.5Ag–0.7Cu/electroless Ni (P) solder joint-Reference-Cited by-同舟云学术

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Characterization of ternary Ni2SnP layer in Sn–3.5Ag–0.7Cu/electroless Ni (P) solder joint

Published:2010-11 Issue:11 Volume:63 Page:1108-1111
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Kang Han-Byul,Bae Jee-Hwan,Yoon Jeong-Won,Jung Seung-Boo,Park Jongwoo,Yang Cheol-Woong

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Cited by 22 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comparative study on the bonding property of laser and reflow soldered Sn-3.0Ag-0.5Cu/Ni–P microbumps after isothermal aging and multiple reflowing;Journal of Materials Research and Technology;2024-03

2. A Study on Combination of ENEPIG Surface Finish and Solder Ball for Solder Joint Reliability;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

3. Intermetallic compound transformation and mechanical strength of Ni–Sn transient liquid phase sinter-bonded joints in an extreme high-temperature environment;Journal of Materials Science: Materials in Electronics;2022-02-03

4. Effects of amorphous Co W and Ni W barrier layers on the evolution of Sn/Cu interface;Materials Characterization;2021-11

5. Comparative study of normal and thin Au/Pd/Ni(P) surface finishes with Sn–3.0Ag–0.5Cu solder joints under isothermal aging;Journal of Materials Science: Materials in Electronics;2021-09-06

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