Control of interfacial reaction layers formed in Sn–3.5Ag–0.7Cu/electroless Ni–P solder joints-Reference-Cited by-同舟云学术

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Control of interfacial reaction layers formed in Sn–3.5Ag–0.7Cu/electroless Ni–P solder joints

Published:2009-02 Issue:4 Volume:60 Page:257-260
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Kang Han-Byul,Bae Jee-Hwan,Lee Jae-Wook,Park Min-Ho,Lee Young-Chul,Yoon Jeong-Won,Jung Seung-Boo,Yang Cheol-Woong

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Reference20 articles.

1. Interfacial reactions between lead-free solders and common base materials

2. Investigation of interfacial reactions between Sn–Zn solder with electrolytic Ni and electroless Ni(P) metallization

3. Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni–P by the molten Sn3.5Ag0.5Cu solder alloy

4. Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate

5. Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization

Cited by 28 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research progress in diffusion barrier for advanced electronic packaging;CAILIAO GONGCHENG;2023

2. Comparative study of normal and thin Au/Pd/Ni(P) surface finishes with Sn–3.0Ag–0.5Cu solder joints under isothermal aging;Journal of Materials Science: Materials in Electronics;2021-09-06

3. Investigation of process parameters in electroless copper plating on polystyrene;Sādhanā;2020-06-12

4. Wettability of high-temperature melts under microgravity and ground gravity conditions;SCIENTIA SINICA Physica, Mechanica & Astronomica;2019-12-06

5. Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint;Journal of Welding and Joining;2017-12-30

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