Microstructure and mechanical properties of low Ga content Sn–8.55Zn–0.5Ag–0.1Al–xGa solders
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference28 articles.
1. Lead-free Solders in Microelectronics
2. Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review
3. Metallurgy of low temperature Pb-free solders for electronic assembly
4. Microstructure evolution of eutectic Sn-Ag solder joints
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1. Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry;Microelectronics Reliability;2022-08
2. The performance and fracture mechanism of solder joints under mechanical reliability test;Microelectronics Reliability;2012-07
3. Effect of bismuth and silver on the corrosion behavior of Sn–9Zn alloy in NaCl 3wt.% solution;Materials Science and Engineering: B;2011-08
4. Development of Sn–Zn lead-free solders bearing alloying elements;Journal of Materials Science: Materials in Electronics;2009-11-19
5. Microstructural evolution of ɛ-AgZn3 and η-Zn phases in Sn–8.5Zn–0.5Ag–0.01Al–0.1Ga solder during aging treatment;Journal of Alloys and Compounds;2009-02
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