Effects of particle size, polishing pad and contact pressure in free abrasive polishing
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics
Reference32 articles.
1. Tribology and Mechanics of Magnetic Storage Devices;Bhushan,1996
2. Y. Xie and B. Bhushan, Fundamental wear studies with magnetic particles and head cleaning agents used in magnetic tapes, Wear, in press.
3. Aggregation and Flow of Solids;Beilby,1921
4. Mechanisms of abrasive polishing;Aghan;Wear,1970
5. Polishing wear;Samuels,1992
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