The interpretation of data from the four-point bend delamination test to measure interfacial fracture toughness
Author:
Publisher
Elsevier BV
Subject
General Materials Science
Reference36 articles.
1. Elastic fracture mechanics concepts for interfacial cracks;Rice;J Appl Mech (Trans ASME),1988
2. The decohesion of thin films from brittle substrates;Hu;Acta Metall,1988
3. The cracking and decohesion of thin brittle films;Hu;Mater Res Soc Symp,1989
4. The fracture energy of bimaterial interfaces;Evans;Mater Sci and Engng,1990
5. Interface crack between two elastic layers;Suo;Int J Fract,1990
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