Residual Stress Effects of Multiple Thermal Material Loads due to a Roughing-Finishing Sequence of Electrical Discharge Machining Processes
Author:
Funder
DFG
Publisher
Elsevier BV
Reference31 articles.
1. Process Signatures – A New Approach to Solve the Inverse Surface Integrity Problem in Machining Processes;Brinksmeier;Procedia CIRP,2014
2. Underlying Mechanisms for Developing Process Signatures in Manufacturing;Brinksmeier;Nanomanuf Metrol,2018
3. Process Signatures - The Missing Link to Predict Surface Integrity in Machining;Brinksmeier;Procedia CIRP,2018
4. Development of a process signature for electrochemical machining;Bergs;CIRP Ann Manuf Technol,2020
5. Analysis of internal material loads and Process Signature Components in deep rolling;Kinner-Becker;CIRP J Manuf Sci Technol,2021
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