Vapor pressure and voiding effects on thin film damage-Reference-Cited by-同舟云学术

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Vapor pressure and voiding effects on thin film damage

Published:2006-05 Issue:1-2 Volume:504 Page:325-330
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Chew H.B.,Guo T.F.,Cheng L.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference21 articles.

1. Cellular Solids: Structure and Properties;Gibson,1997

2. IEEE/IRPS International Reliability of Physics Symposium, Orlando, FL;Fukuzawa,1985

3. Popcorning: a failure mechanism in plastic-encapsulated microcircuits

4. Vapor pressure and void size effects on failure of a constrained ductile film

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1. Mechanism-Based Modeling of Thermal- and Moisture-Induced Failure of IC Devices;Moisture Sensitivity of Plastic Packages of IC Devices;2010

2. Prediction of the failure metal/composite bonded joints;Computational Materials Science;2009-05

3. Thermomechanical Analysis of Plastic Ball Grid Arrays With Vapor Pressure Effects;IEEE Transactions on Components and Packaging Technologies;2009-03

4. Influence of Nonuniform Initial Porosity Distribution on Adhesive Failure in Electronic Packages;IEEE Transactions on Components and Packaging Technologies;2008-06

5. Influence of the chemical and electronic structure on the electrical behavior of zirconium oxynitride films;Journal of Applied Physics;2008-05-15

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