1. IEEE Proceedings of the International Interconnect Technology Conference, San Francisco, U.S.A., May 24–26;Gao,1999
2. Proceedings of the 19th VLSI Multilevel Interconnection Conference, Singapore, Nov 19–20;Bliznetsov,2002
3. Proceedings of the 5th International Symposium on Low and High Dielectric Constant Materials: Materials Science, Processing, and Reliability Issues, Toronto, Canada, May 14–18;Shepherd,2000
4. Comparative study of SiOCH low-k films with varied porosity interacting with etching and cleaning plasma