Chemical formation of palladium-free surface-nickelized polyimide film for flexible electronics-Reference-Cited by-同舟云学术

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Chemical formation of palladium-free surface-nickelized polyimide film for flexible electronics

Published:2008-04 Issue:12 Volume:516 Page:4258-4266
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Hsiao Yu-Sheng,Whang Wha-Tzong,Wu Sheng-Chang,Chuang Kuen-Ru

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference33 articles.

1. Comparison of the electrical properties of polyimide films containing surface metal oxide: Cobalt oxide vs. tin oxide

2. Modifier and Polymer Interactions in Metal-Modified Polyimide Composites

3. Use of high temperature and high humidity to test the adhesion of sputtered copper to a polyimide surface modified by an AC nitrogen glow discharge

4. Enhanced Cu‐Teflon adhesion by presputtering prior to the Cu deposition

5. Improved adhesion between plasma-treated polyimide film and evaporated copper

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