Seismically constrained thermo-rheological structure of the eastern Tibetan margin: Implication for lithospheric delamination
Author:
Publisher
Elsevier BV
Subject
Earth-Surface Processes,Geophysics
Reference101 articles.
1. Crustal and mantle strengths in continental lithosphere: is the jelly sandwich model obsolete?;Afonso;Tectonophysics,2004
2. When and where did India and Asia collide?;Aitchison;J. Geophys. Res.,2007
3. Differential exhumation in response to episodic thrusting along the eastern margin of the Tibetan Plateau;Arne;Tectonophysics,1997
4. Crustal deformation of the eastern Tibetan plateau revealed by magnetotelluric imaging;Bai;Nat. Geosci.,2010
5. Upper mantle P-wave tomography across the Longmenshan fault belt from passive-source seismic observations along Aba–Longquanshan profile;Βai;J. Asian Earth Sci.,2011
Cited by 26 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Extent of the lower crustal flow constrained by the rheological structure at the eastern boundary of the Chuan-Dian Rhombus Block;Tectonophysics;2023-12
2. Terrestrial heat flow measurement and numerical simulation of lithospheric thermal structure in western Sichuan, China;Geoenergy Science and Engineering;2023-09
3. Mechanisms to generate ultrahigh-temperature metamorphism;Nature Reviews Earth & Environment;2023-04-04
4. 3D velocity and anisotropy of the southeastern Tibetan plateau extracted by joint inversion of wave gradiometry, ambient noise, and receiver function;Tectonophysics;2023-02
5. Cross Orogenic Belts in Central China: Implications for the tectonic and paleogeographic evolution of the East Asian continental collage;Gondwana Research;2022-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3