Temperature measurement assisted modal tracking of an instrumented building
Author:
Funder
Universidad de Chile
Publisher
Elsevier BV
Subject
Civil and Structural Engineering
Reference41 articles.
1. Rapid earthquake loss assessment after damaging earthquakes;Erdik;Soil Dyn Earthquake Eng,2011
2. Jaiswal K, Wald DJ. Rapid estimation of the economic consequences of global earthquakes. US Geological Survey; 2011.
3. Post-earthquake continuous dynamic monitoring of the Gabbia Tower in Mantua, Italy;Saisi;Constr Build Mater,2015
4. Earthquake damage detection in the Imperial County Services Building III: analysis of wave travel times via impulse response functions;Todorovska;Soil Dyn Earthquake Eng,2008
5. Monitoring a building using deconvolution interferometry. I: Earthquake-data analysis;Nakata;Bull Seismol Soc Am,2013
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Monitoring the changes in the dynamic properties of an RC building experiencing column loss;Journal of Civil Structural Health Monitoring;2024-03-26
2. Structural health monitoring of South America's first 6-Story experimental light-frame timber-building by using a low-cost RaspberryShake seismic instrumentation;Engineering Structures;2023-01
3. Investigation of long-term modal properties of a supertall building under environmental and operational variations;Journal of Building Engineering;2022-12
4. Daily and seasonal effects of environmental temperature and humidity on the modal properties of structures;Bulletin of Earthquake Engineering;2022-07
5. Unified method for fully automated modal identification and tracking with consideration of sensor deployment;Engineering Structures;2022-06
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3