Effects of humid environment on thermal and mechanical properties of a cold-curing structural epoxy adhesive
Author:
Publisher
Elsevier BV
Subject
General Materials Science,Building and Construction,Civil and Structural Engineering
Reference59 articles.
1. Cold-curing epoxy resins: aging and environmental effects I – Thermal Properties;Frigione;J Polym Eng,2001
2. Water effects on the bond strength of concrete/concrete adhesive joints;Frigione;Constr Build Mater,2006
3. Environmental effects on epoxy adhesives employed for restoration of historical buildings;Frigione;J Mater Civil Eng,2006
4. Effect of hygrothermal aging history on sorption process, swelling, and glass transition temperature in a particle-filled epoxy-based adhesive;Fernández-García;J Appl Polym Sci,2002
5. Irreversible effects of hygrothermal aging on DGEBA/DDA epoxy resin;Xiao;J Appl Pol Sci,1998
Cited by 88 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of various aging conditions and treatment methods on thermal degradation of coffee waste/epoxy composites;Industrial Crops and Products;2024-11
2. Structural effects on heat capacity, moisture absorption and thermal expansion of epoxy-novolac polymers;Chemical Physics;2024-11
3. Moisture Absorption Characterization and Mechanical Properties of CFRP Under the Combined Effects of Seawater and Continuous Bending Stress;Applied Composite Materials;2024-07-25
4. Performance evolution of epoxy adhesive and CFRP-steel epoxy-bonded joints subjected to hygrothermal exposure;Construction and Building Materials;2024-05
5. Bond performance of NSM FRP–concrete interfaces with epoxy under chloride‐salt conditioned environments;Structural Concrete;2024-04-27
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3