Influence of bismuth (Bi) addition on wetting characteristics of Sn-3Ag-0.5Cu solder alloy on Cu substrate

Author:

Erer Ahmet Mustafa,Oguz Serkan,Türen Yunus

Publisher

Elsevier BV

Subject

Metals and Alloys,Computer Networks and Communications,Fluid Flow and Transfer Processes,Hardware and Architecture,Mechanical Engineering,Biomaterials,Civil and Structural Engineering,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. Physicochemical Properties of Sn-Zn and SAC+Bi Alloys;Thomas;J. Electron. Mater.,2013

2. Mechanical strength and its variability in Bi-modified Sn-Ag-Cu solder alloy;Matahir;J. Achiev. Mater. Manuf. Eng.,2011

3. Getting ready for lead-free solders;Lee;Soldering Surf. Mount Technol.,1997

4. Physics and materials challenges for lead-free solders;Tu;J. Appl. Phys.,2003

5. Joint strength and interfacial microstructure between Sn-Ag-Cu and Sn-Zn-Bi solders and Cu substrate;Hirose;Sci. Technol. Adv. Mater.,2004

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