Thin silicon via crack-assisted layer exfoliation for photoelectrochemical water splitting
Author:
Funder
Australian Research Council
Australian Renewable Energy Agency
Publisher
Elsevier BV
Subject
Multidisciplinary
Reference60 articles.
1. Stress in thin films and coatings: current status, challenges, and prospects;Abadias;J. Vac. Sci. Technol. A,2018
2. Graphene-Al2O3-silicon heterojunction solar cells on flexible silicon substrates;Ahn;J. Appl. Phys.,2017
3. Relationships between fracture parameters and fracture surface roughness of brittle polymers;Arakawa;Int. J. Fract.,1991
4. Back-illuminated Si photocathode: a combined experimental and theoretical study for photocatalytic hydrogen evolution;Bae;Energy Environ. Sci.,2015
5. Kerf-less removal of Si, Ge, and III–V layers by controlled spalling to enable low-cost PV technologies;Bedell;IEEE J. Photovolt.,2012
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