Enhanced pool boiling performance of a porous honeycomb copper surface with radial diameter gradient-Reference-Cited by-同舟云学术

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Enhanced pool boiling performance of a porous honeycomb copper surface with radial diameter gradient

Published:2020-08 Issue: Volume:157 Page:119867
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Mo Dong-Chuan,Yang Shuo,Luo Jia-Li,Wang Ya-Qiao,Lyu Shu-Shen

Funder

National Natural Science Foundation of China

Natural Science Foundation of Guangdong

Pearl River S&T Nova Program of Guangzhou

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference40 articles.

1. Effect of liquid spreading due to nano/microstructures on the critical heat flux during pool boiling;Ahn;Applied Physics Letters,2011

2. Copper vertical micro dendrite fin arrays and their superior boiling heat transfer capability;Wang;Applied Surface Science,2017

3. Wettability modification to further enhance the pool boiling performance of the micro nano bi-porous copper surface structure;Wang;Int. J. Heat Mass Transf.,2018

4. Pool boiling heat transfer of FC-72 on pin-fin silicon surfaces with nanoparticle deposition;Cao;Int. J. Heat Mass Transf.,2018

5. Microstructured Surfaces for Enhanced Pool Boiling Heat Transfer;Chu;Applied Physics Letters,2012

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2. Bottom-up design of micro-/nano hierarchical surface for the enhancement of boiling heat transfer performance: A review;International Journal of Heat and Mass Transfer;2024-12

3. Research on molecular dynamics of heat and mass transfer of liquids on surfaces with different shapes of nanoscale pore structures;International Journal of Heat and Fluid Flow;2024-12

4. Pool boiling heat transfer enhancement induced by capillary wicking from radial gradient structures: A lattice boltzmann study;Applied Thermal Engineering;2024-07

5. Enhancement of pool boiling heat transfer by laser texture-deposition on copper surface;Applied Surface Science;2024-07

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