Heat dissipation performance improvement of a solid-state fan using copper foams as collecting electrode-Reference-Cited by-同舟云学术

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Heat dissipation performance improvement of a solid-state fan using copper foams as collecting electrode

Published:2023-03 Issue: Volume:202 Page:123730
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Li Zheng-sheng,Wang Jing^ORCID,Cai Rong-jie,Wang Jun

Funder

Key Laboratory of Low-grade Energy Utilization Technology and System, Chongqing University

Chongqing University

Natural Science Foundation of Jiangsu Province

Priority Academic Program Development of Jiangsu Higher Education Institutions

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference52 articles.

1. Heat and fluid flow in high-power LED packaging and applications;Luo;Prog. Energy Combust. Sci.,2016

2. State of the art of high heat flux cooling technologies;Agostini;Heat Transf. Eng.,2007

3. Obtaining velocity and pressure distributions in natural convection flows using experimental temperature fields;Vinnichenko;Appl. Therm. Eng.,2022

4. A numerical study on the natural convective heat loss of an isothermal upward-facing cylindrical cavity;Wang;Appl. Therm. Eng.,2022

5. Comprehensive thermal resistance model of forced air cooling system for multiple power chips;Lin;Energy Rep.,2021

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1. Improvement of an ionic wind blower’s flow characteristic by auxiliary electrodes for thermal management of light-emitting diodes;International Journal of Heat and Fluid Flow;2024-10

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3. Production of fungal phytases in solid state fermentation and potential biotechnological applications;World Journal of Microbiology and Biotechnology;2023-11-27

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