Author:
Yuan Chao,Xie Bin,Huang Mengyu,Wu Ruikang,Luo Xiaobing
Funder
National Science Foundation of China
Ministry of Science and Technology of China
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference28 articles.
1. Materials for Advanced Packaging;Lu,2009
2. Nano-Bio-Electronic, Photonic and MEMS Packaging;Wong,2010
3. LED Packaging for Lighting Applications: Design, Manufacturing, and Testing;Liu,2011
4. Emerging challenges and materials for thermal management of electronics;Moore;Mater. Today,2014
5. Thermal resistance of particle laden polymeric thermal interface materials;Prasher;J. Heat Transfer,2003
Cited by
57 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Liquid Cooling for High‐Heat‐Flux Electronic Devices;Thermal Management for Opto‐electronics Packaging and Applications;2024-05-31
2. Thermal Management in Downhole Devices;Thermal Management for Opto‐electronics Packaging and Applications;2024-05-31
3. Thermally Enhanced Thermal Interfacial Materials;Thermal Management for Opto‐electronics Packaging and Applications;2024-05-31
4. Opto‐Thermal Coupled Modeling;Thermal Management for Opto‐electronics Packaging and Applications;2024-05-31
5. The Influence of Reinforced Fibers and Opacifiers on the Effective Thermal Conductivity of Silica Aerogels;Gels;2024-04-26