Funder
The Ministry of Education Doctoral Fund of China
National Natural Science Foundation of China
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference29 articles.
1. John H. Lau, Tang Gong Yue, Thermal management of 3D IC integration with TSV (through silicon via). Electronic Components and Technology Conference, 2009. ECTC 2009. 59th. IEEE, 2009, pp. 635–640.
2. Min Ni, et al., An analytical study on the role of thermal TSVs in a 3DIC chip stack, in: Proceedings of the Design Automation and Test in Europe (DATE), 2010, pp. 137–141.
3. Leslie Hwang, Kevin L. Lin, Martin D.F. Wong, Thermal via structural design in three-dimensional integrated circuits, Quality Electronic Design (ISQED), 2012 13th International Symposium on. IEEE, 2012, pp. 103–108.
4. Chung-Han Chou, et al., On the futility of thermal through-silicon-vias, VLSI Design, Automation, and Test (VLSI-DAT), 2013 International Symposium on. IEEE, 2013.
5. Hu Xu, Vasilis F. Pavlidis, Giovanni De Micheli, Analytical heat transfer model for thermal through-silicon vias, Design, Automation & Test in Europe Conference & Exhibition (DATE), 2011. IEEE, 2011, pp. 1–6.
Cited by
24 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献