Thermal modeling and comparative analysis of jet impingement liquid cooling for high power electronics-Reference-Cited by-同舟云学术

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Thermal modeling and comparative analysis of jet impingement liquid cooling for high power electronics

Published:2019-07 Issue: Volume:137 Page:42-51
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Wu Ruikang,Hong Tao,Cheng Qingyu,Zou Hao,Fan Yiwen,Luo Xiaobing

Funder

National Natural Science Foundation of China

Ministry of Science and Technology of the Peoplés Republic of China

Creative Research Groups Funding of Hubei Province

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference43 articles.

1. Heat management in power converters: from state of the art to future ultrahigh efficiency systems;Laloya;IEEE Trans. Power Electr.,2016

2. An optical-thermal model for laser-excited remote phosphor with thermal quenching;Ma;Int. J. Heat Mass Transf.,2018

3. Passive thermal management system for downhole electronics in Harsh thermal environments;Shang;Appl. Therm. Eng.,2017

4. A critical review of traditional and emerging techniques and fluids for electronics cooling;SOhel Murshed;Renew. Sust. Energy Rev.,2017

5. Heat and fluid flow in high-power LED packaging and applications;Luo;Prog. Energy Combust. Sci.,2016

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2. Experimental study on the control of temperature oscillation in power electronics via pulsating jet impingement;International Journal of Thermal Sciences;2024-10

3. Thermal and hydraulic characteristics of a single reverse nanofluid jet in a double-wall cooling configuration;Journal of Thermal Analysis and Calorimetry;2024-08-19

4. Enhancement of heat dissipation in a minichannel by different structural designs of vortex generators and aluminum oxide hydroxide nanoparticles;International Journal of Heat and Fluid Flow;2024-07

5. The effects of outlet size, shape, and location on spatial temperature distribution reduction via direct jet impinging in power electronics;Applied Thermal Engineering;2024-07

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