Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference49 articles.
1. Cramming more components onto integrated circuits;Moore;Electronics,1965
2. Experimental investigation of microchannel coolers for the high heat flux thermal management of GaN-on-SiC semiconductor devices;Calame;Int. J. Heat Mass Transfer,2007
3. Device-level Thermal Analysis of GaN-based Electronics;Bagnall,2013
4. Recent advances in MEMS-based micro heat pipes;Qu;Int. J. Heat Mass Transfer,2017
5. Hot spot analysis in integrated circuit substrates by laser mirage effect;Perpiñà;Appl. Phys. Lett.,2011
Cited by
24 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献